USC Receives $26.9 Million from U.S. Department of Defense for Technology Development
USC has been awarded $26.9 million by the U.S. Department of Defense to establish advanced technologies that aim to reduce America’s reliance on foreign microelectronics and protect the nation from supply chain risks. This exciting announcement was made on Wednesday.
The new “innovation hub” at USC will focus on the development of microelectronics in various areas, including electromagnetic warfare, secure computing at the tactical edge, internet of things, artificial intelligence hardware, 5G and 6G wireless, and quantum technology. Deputy Defense Secretary Kathleen Hicks shared these details during a briefing.
Under the CHIPS Act, which aims to bring semiconductor manufacturing back to the United States, USC will develop one of eight Microelectronic Commons regional innovation hubs. This act was passed by Congress and signed into law by President Joe Biden last year.
Senator Dianne Feinstein Congratulates USC
Senator Dianne Feinstein congratulated USC on receiving this prestigious award. In a statement, she said, “These innovation hubs will develop cutting-edge technologies in artificial intelligence, cybersecurity, and hardware for national defense, among others. They will create high-paying jobs and be a great asset to the tech industry in both Northern and Southern California.”
Stanford University and UC Berkeley Also Receive Microelectronic Commons Awards
Apart from USC, Stanford University and UC Berkeley were also awarded Microelectronic Commons grants by the Department of Defense.
“Although America excels in the research and design of microelectronics, we have fallen behind in terms of prototyping, manufacturing, and large-scale production,” Hicks stated.
The United States currently only accounts for approximately 12% of global microelectronics production, with the majority of production taking place in Asia. The Department of Defense added that the U.S. lacks the capacity to confirm the viability and marketability of new microelectronics technologies, making it difficult to attract investment from American industries.
Through the Microelectronics Commons program, which has received $2 billion in funding for fiscal years 2023-2027, the Department of Defense aims to leverage these innovation hubs to accelerate domestic hardware prototyping and manufacturing of semiconductor technologies. This will not only mitigate supply chain risks but also ensure swift access to cutting-edge microchips for American troops.
Hicks emphasized that these hubs will address technical challenges relevant to the Department of Defense’s missions. The goal is to equip our troops with the most advanced microchips in various systems such as ships, planes, tanks, long-range munitions, communications gear, sensors, and more.
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