TSMC has revealed plans to invest $2.9 billion in advance chip packaging, citing the rapid growth of the artificial intelligence market. The announcement comes after TSMC’s CEO C.C. Wei highlighted “strong demand” for AI-related chips during the firm’s second-quarter earnings report. To meet this demand, TSMC aims to increase its capacity and expects the tightening to be released next year. The company’s chief financial officer, Wendell Huang, also expressed optimism for strong growth in 3-nanometer chips, which TSMC specializes in. However, TSMC recently delayed production at its Arizona facility due to a shortage of skilled workers.
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