Get ready for the upcoming Samsung Galaxy S24 Unpacked event on January 17, following FCC approval. Rumors suggest that while the lineup may not have groundbreaking upgrades, there will be some key changes to set it apart from the previous range. According to Windows Report, the phones’ expected specs and new renders have been unveiled.
Reports are aligning with rumors about the Galaxy S24 Ultra featuring a 50MP 5x zoom periscope camera, a flat screen, increased battery sizes for the base and Plus models, and new AI features across the lineup.
The new phones are rumored to include real-time message translation, generative AI for image editing, and improved search capabilities, such as the ability to display information about highlighted areas in images by the user.
Rumors initially suggested only the Galaxy S24 Ultra would have a titanium frame, but now it seems that all three models may have a shift from aluminum to titanium frames, with today’s report confirming that only the Galaxy S24 Ultra will have titanium sides.
Expect the phones to come in black, gray, violet, and yellow, albeit with different marketing names for each color option.
The enhanced AI capabilities will necessitate more advanced cooling, prompting all phones to come with larger vapor chambers. The S24 Ultra is said to have a chamber 1.9 times larger, the S24 Plus 1.5 times larger, and the S24 1.6 times larger.
Notably, the Galaxy S24 is rumored to be powered by the Exynos 2400, which may come as a surprise. This deviates from previous rumors, and suggests a potential shift from the Qualcomm Snapdragon 8 Gen 3 that was initially expected for the base model. Reports speculate that cost savings may be a factor behind this decision, as the Snapdragon 8 Gen 3 is rumored to be pricier than its predecessor.
This change may have different impacts across regions, with European and Asian consumers potentially less affected given Samsung’s usual use of Exynos chips in their phones for these markets. On the other hand, American and Chinese buyers may have different expectations based on previous models’ chipsets.
